The post silicon chip testing method refers to the testing conducted after the chip packaging is completed, aiming to test the functionality, performance, and reliability of the chip.

wafer chuck， The wafer chuck is a key component used in semiconductor equipment to fix and support wafers, providing a stable support platform for wafers in various processing techniques, ensuring the positional accuracy and stability of wafers during processing.

As a key component in semiconductor equipment, the performance of wafer chuck directly affects the quality and efficiency of semiconductor manufacturing.

The essential difference between ICP and CCP lies in the energy coupling mode, and the two complement each other in advanced processes.

Bscan (Boundary Scan) is a technology used for chip testing and debugging, mainly for detecting and diagnosing interconnect faults inside chips or on PCBs (printed circuit boards).

When testing IOH and IOL, it is necessary to set VOL and VOL. When testing VOH and VOL, it is necessary to set IOH and IOL.

The experimental condition strength of HAST at 130 ℃ 85% RH for 96 hours is higher than that of THB at 85 ℃ 85% RH for 1000 hours.

In ICP etching equipment, the induction coil is generally located above or around the reaction chamber. When RF current passes through the coil, a periodically changing magnetic field is generated.