Reliability testing refers to determining and verifying the reliability of a product through experimentation. Research on identifying weak links in products with limited samples, time, and usage costs. Reliability testing is a general term for various tests conducted to understand, evaluate, analyze, and improve the reliability of products.

Digital Logic Testing is mainly used to detect the digital circuit part of a chip, ensuring its logic function, timing characteristics, and structural integrity.

Environmental Stress Screen (ESS) is the process of accelerating the exposure of potential defects within electronic or electromechanical products by applying reasonable environmental stress (such as temperature cycling, random vibration, etc.) or electrical stress within the design range.

Burn in is a specially designed test vector used to activate various modules inside the chip during aging testing, ensuring that the chip can operate normally under accelerated stress conditions such as high temperature and high voltage, thereby detecting potential defects and faults in advance and improving the reliability and quality of the chip.

In the reliability verification of microelectronic devices, temperature cycling (TC) and thermal shock (TS) are two crucial environmental stress tests.

Three temperature testing refers to the performance testing of chips under three different temperature conditions (normal temperature, low temperature, high temperature), aiming to comprehensively evaluate the reliability and stability of chips under different environmental temperatures.

The PCW system, also known as the process cooling water system, is a critical water circulation system used in industrial production to provide cooling for equipment and machinery.

In the field of electronic product reliability testing, HAST (Highly Accelerated Stress Test) and PCT (Pressure Cooker Test) are two commonly used high-temperature and high humidity accelerated aging testing methods.