Temperature Forcing Systems and ATE are produced for mass production
The wafer test is completed by ATE and Prober; The finished product test is completed by ATE with high and low temperature impact airflow meter.
2023-01-16 10:00:00
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Packaging structure and failure mechanism of crimped IGBT power module
Failure mechanism of crimping IGBT power module package2023-01-16 09:30:00![]()
Application of heat flow meter to classification of reliability test grade
Reliability is a measure of product durability.2023-01-14 10:00:00![]()
Introduction to the basic principle and application of DFT
DFT technology is simply to add DFT logic to the chip design, and then after the chip manufacturing is completed, test the chip through the added DFT logic in advance to select the chip with no problems.2023-01-14 09:30:00![]()
What are the types of WAT test structures
WAT test structure usually includes all active and passive components of the process platform2023-01-13 08:56:25![]()
Chip aging test and reliability test
After the chip is packaged, there may be potential defects, which may lead to unstable chip performance or potential defects in function.2023-01-13 08:54:37![]()
What are the stages of a complete SoC design process?
SOC design process, including the whole process of digital circuit design front-end and back-end.2023-01-13 08:51:21![]()
Why is chip testing becoming more important?
Chip testing is an important link to ensure product yield and cost control.2023-01-12 10:30:00
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