The two box cold and hot shock test chamber is a device used to test the tolerance of products. By constantly changing the temperature, it detects whether the product is damaged. The thermal and cooling effects generated will simulate climate change in various extreme scenarios.

The Bench Top Temperature Forcing System ThermoTST ATC series adopts advanced design and technology, with a wide temperature range

Types and testing conditions of wafer temperature cycle reliability testing

Wafer back cooling technology, as an effective temperature management method, not only ensures the uniformity of wafer temperature, but also enhances the stability during wafer processing.

HASS, also known as high acceleration stress screening experiment, aims to ensure that the produced product does not have any hidden defects or to find and solve these defects before the product leaves the factory

Temperature deviation: Under the stable state of ThermoChamber, the deviation between the measured maximum and minimum temperatures of each measuring point in the working space and the set temperature within the specified time.

The goal of waste gas treatment devices is to reduce the concentration of harmful substances in waste gas, ensure that emissions comply with environmental regulations and standards, and protect the environment and human health.

There are two main types of vacuum suction cups: non hot chuck and hot chuck. The heat card has an overall heating or cooling function, which can maintain the wafer at a specific temperature during the processing.