The significance of TC high-temperature cycling test is to confirm the effect of mechanical stress on the welding performance of devices at extremely high temperatures, extremely low temperatures, and alternating high and low temperatures

With the reduction of design rules, many etching processes have shifted towards very fast plasma etching process steps, which require highly precise control of all reaction inputs.

Plasma etching may be the most important process in semiconductor manufacturing, or it may be the most complex among all wafer fab operations, second only to photolithography.

HALT is not a pass/fail test, but a series of tests conducted on the product to help improve its reliability.

In the chip design phase, it is necessary to plan the testing content and methods based on the specifications and parameters of each chip.

ThermoTST TS560 temperature test range -70 ℃ to+225 ℃, meeting the operating temperature range of various levels of the AEC-Q100 standard environment.

Chip testing generally involves two major steps, one called CP (Chip Probing) and the other called FT (Final Test). CP is testing for wafers, FT is testing for packaged chips

The ThermoTST Thermal Inducing System recommends performing maintenance and temperature calibration work every 12 months, replacing consumables such as filter cartridges, and the time interval also depends on the application environment and usage time of the equipment.