In the manufacturing process of the semiconductor industry, it can be mainly divided into four steps: IC design, wafer manufacturing process, wafer testing, and wafer packaging.

Regarding the packaging structure of power devices, domestic and foreign research institutions and enterprises have conducted extensive theoretical research and development practices in structural design. Multiple structural packaging design concepts have been proposed and studied by domestic and foreign research institutions, and some structural design schemes have been successfully applied to commercial power devices.

Many testing requirements in the reliability testing process of optical communication, chips, integrated circuits, laboratory research and other fields need to be equipped with high and low temperature cycle testing systems

As a core component of power electronic systems, power semiconductors have been widely used in fields such as life, transportation, power, industrial control, aerospace, and naval vessels.

High thermal conductivity packaging materials and connection processes, debonded wire connections, large area contact, multiple heat dissipation paths simultaneously shortening the heat dissipation path, and reducing the thermal resistance of the heat dissipation path may be key features that future high-voltage, high-temperature, and high-power device packaging should have.

With the continuous development of technology in many fields such as aerospace, automotive electronics, military, photovoltaic, and industrial automation, the application of chips in various extreme temperature environments is becoming increasingly widespread.

ThermoTST TS760 Precision Temperature Cycling System is applied to reliability tests such as product characteristic analysis, high and low temperature temperature variation testing, temperature impact testing, and failure analysis

There is a risk that sealed components may be overlooked by the manufacturer during the production process and lead to component failure during subsequent use, which is the excess small loose particles that appear inside the sealed components.